Process for preparing a nonconductive substrate for electroplati

Chemistry: electrical and wave energy – Processes and products

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204 20, 204 26, C25D 502, C25D 554

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active

049649590

ABSTRACT:
Described herein is an improved process for electroplating a conductive metal layer to the surface of a nonconductive material comprising the following steps:

REFERENCES:
patent: 1037469 (1912-09-01), Goldberg
patent: 1352331 (1920-09-01), Unno
patent: 2243429 (1941-05-01), Leipzig
patent: 3099608 (1963-07-01), Radovsky et al.
patent: 3163588 (1955-02-01), Shortt et al.
patent: 4035265 (1977-07-01), Saunders
patent: 4090984 (1978-05-01), Linn et al.
patent: 4239794 (1980-12-01), Allard
patent: 4619741 (1986-10-01), Minten et al.
patent: 4622107 (1986-11-01), Piano
patent: 4622108 (1986-11-01), Polakovic et al.
patent: 4631117 (1986-12-01), Minten et al.
patent: 4684560 (1987-08-01), Minten et al.
patent: 4718993 (1988-01-01), Cupta et al.
patent: 4724005 (1988-02-01), Minten et al.
patent: 4874477 (1989-10-01), Pendleton

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