Process for preparing a non-conductive substrate for electroplat

Details Process for preparing a non-conductive substrate for electroplat Process for preparing a non-conductive substrate for electroplat

1996-02-21

1997-05-27

Gorgos, Kathryn

Compositions

Electrolytes for electrical devices

252502, 252503, 252510, 106472, 106474, 106476, 106478, 205125, 205164, 205166, H01B 104, H01B 106, C09C 144, C25D 502

Patent

active

056329270

ABSTRACT:
The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards.

REFERENCES:
patent: 3279935 (1966-10-01), Daniell et al.
patent: 4879335 (1989-11-01), Hirota et al.
patent: 4964959 (1990-10-01), Nelsen et al.
patent: 5234627 (1993-08-01), Damschroder
patent: 5476580 (1995-12-01), Thorn et al.

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