Process for preparing a non-conductive substrate for electroplat

Details Process for preparing a non-conductive substrate for electroplat Process for preparing a non-conductive substrate for electroplat

1995-02-10

1996-07-16

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205159, 205162, 205163, 205164, 205165, 205166, 205167, 205183, 205205, C25D 502, C10M12502, C10M12504, C10M17300

Patent

active

055363865

ABSTRACT:
The modification of carbon particles is disclosed for achieving enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards.

REFERENCES:
patent: 2872391 (1959-02-01), Hauser et al.
patent: 4041347 (1977-08-01), Deal et al.
patent: 4379762 (1983-04-01), Chiyoda et al.
patent: 4434064 (1984-02-01), Chao et al.
patent: 4888134 (1989-12-01), Kleitz et al.
patent: 4964959 (1990-10-01), Nelsen et al.
patent: 5234627 (1993-08-01), Damschroder
patent: 5389270 (1995-02-01), Thorn et al.

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