Process for preparing a non-conductive substrate for electroplat

Details Process for preparing a non-conductive substrate for electroplat Process for preparing a non-conductive substrate for electroplat

1997-02-26

1998-06-02

Gorgos, Kathryn L.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating predominantly nonmetal substrate

205125, 205164, 205166, 205167, 205205, C25D 554, C25D 556, C25D 502

Patent

active

057593787

ABSTRACT:
The modification of carbon particles is proposed to achieve enhanced plating upon a non-conductive surface which has been previously treated with said modified carbon particles. The invention is particularly useful in plating through holes of printed circuit boards.

REFERENCES:
patent: 4622107 (1986-11-01), Piano
patent: 4964959 (1990-10-01), Nelsen et al.
patent: 5500106 (1996-03-01), Goldberg
patent: 5536386 (1996-07-01), Ferrier et al.

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