Process for preparing a metallized polymide film containing a hy

Details Process for preparing a metallized polymide film containing a hy Process for preparing a metallized polymide film containing a hy

1996-05-30

1997-09-16

Pianalto, Bernard

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating has specified thickness variation

204471, 204486, 427250, 4272557, 427296, 427301, 427306, 427316, 427322, 427404, 427539, 427573, 427536, 205158, 205165, 205186, H05H 100, C23C 1400

Patent

active

056678517

ABSTRACT:
A vacuum metallized polyimide film comprising an aromatic polyimide layer containing a hydrocarbyl tin compound in oxidation states (II) or (IV) as an additive and a metal plated layer bonded integrally with a high bonding strength or high adhesion through a vacuum deposited metal layer without the use of an adhesive. The metallized polyimide film can be used for flexible printed circuits and multilayer printed wiring boards, as well as for heaters, antennas and antistatic films.

REFERENCES:
patent: 5130192 (1992-07-01), Takabayashi et al.
patent: 5137791 (1992-08-01), Swisher
patent: 5218034 (1993-06-01), Milligan et al.
patent: 5272194 (1993-12-01), Arduengo et al.
Macromolecules, vol. 17, 1984 Easton US, pp. 1627-1632, Ezzel et al., "Surface-Semiconductive Polyimide Films Containing Tin Complexes" (No Month Available).

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