Process for preparing a low stress agent & an epoxy composition

Details Process for preparing a low stress agent & an epoxy composition Process for preparing a low stress agent & an epoxy composition

1988-11-23

1990-11-20

Jacobs, Lewis T.

Synthetic resins or natural rubbers -- part of the class 520 ser

Synthetic resins

Processes of preparing a desired or intentional composition...

523205, 523206, 523209, 523400, 523457, 523466, 524437, 524445, 524451, C08K 906, C08L 6300

Patent

active

049720082

ABSTRACT:
A low stress agent which increases the coherence of organic materials and an inorganic filler, decreases the modulus in molded articles which absorb stress and impact energy is prepared by a process which comprises preparing a silane-modified reactive liquid polymer from a silane coupling agent and a reactive liquid polymer containing functional groups or double bonds, treating the surface of an inorganic filler with a silane coupling agent, and reacting said silane modified reactive liquid polymer with said treated inorganic filler. An epoxy resin or phenol resin composition which contains the low stress agent is very suitable for use in encapsulating a semiconductor.

REFERENCES:
patent: 4071494 (1978-01-01), Gaylord
patent: 4425384 (1984-01-01), Brownscombe
patent: 4478963 (1984-10-01), McGarry
patent: 4530894 (1985-07-01), Imamura et al.

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