Process for preparing a ceramic electronic circuit board and pro

Details Process for preparing a ceramic electronic circuit board and pro Process for preparing a ceramic electronic circuit board and pro

1997-07-29

1999-10-12

Beck, Shrive

Coating processes

Electrical product produced

Metallic compound coating

427 58, 427357, 4273981, 427431, 4274432, B05D 512, B05D 302, B05D 312

Patent

active

059651938

ABSTRACT:
Molten aluminum and a ceramic substrate are held in direct contact with each other and thereafter cooled to have the aluminum joined directly to the ceramic substrate. This method is capable of consistent and easy production of aluminum-ceramics composite substrates having satisfactory joint strength, thermal conductivity and heat resistance characteristics. A ceramic member is fed successively into and through molten metal to directly bond the metal on the ceramic to produce a metal-bonded-ceramic (MBC) material at a low cost. An electronic circuit substrate made of an aluminum ceramic composite material wherein an electronic circuit is formed on an aluminum surface of the aluminum-ceramic composite material. The aluminum-ceramic composite material is made by directly solidifying molten aluminum or an aluminum alloy on at least a portion of a ceramic substrate.

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