Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1989-11-03
1991-07-16
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 98, 427306, 427307, C23C 2600
Patent
active
050324276
ABSTRACT:
Disclosed herein is a process for preparing the surfaces of through-holes in printed circuit boards (especially multilayer printed circuit boards) for subsequent metallization, in which the through-hole surfaces are treated with a substantially water-immiscible organic liquid which acts upon the insulating substrate of the board, and preferably in the form of a substantially homogeneous, clear mixture comprised of the water-immiscible organic liquid, water, an alkali metal compound and a surfactant component, followed by treatment of the through-hole surfaces with an alkaline permanganate solution. The process can be used as a desmearing and/or etch-back process, a combined desmearing-conditioning process, or a conditioning process following a separate desmearing process.
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Milton J. Rosen et al., "Systematic Analysis of Surface-Active Agents", Wiley-Interscience, 1972, pp. 39-41.
Peter E. Kukanskis, "Improved Smear Removal Process for Multilayer Circuit Boards".
F. Tomaiuolo & P. Montangero, "Alkaline Permanganate Treatment in Etch-Back Processes", 1986.
D'Ambrisi Joseph J.
Kukanskis Peter E.
Kuzmik John J.
Beck Shrive
MacDermid Incorporated
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