Process for preparation of metal patterns on insulating carrier

Radiation imagery chemistry: process – composition – or product th – Post imaging processing – Physical developing

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Details

427 98, 427305, 427306, 427404, C23C 302, H05K 318

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active

042620856

ABSTRACT:
A process for the preparation of metal patterns on insulating carriers by photochemical means, in particular for the preparation of printed circuits, is described, in which the carrier is treated with a photo-sensitizer in the absence of wetting agents; the carrier is irradiated in a manner corresponding to the desired pattern with a radiation source; the metal seeds formed on the surface are augmented with an aqueous palladium-salt solution; a nickel layer is deposited with a nickel or nickel-cobalt bath; the metal layer is treated with an aqueous solution containing a complex-forming agent for copper-(I) ions; and a copper layer is deposited with a currentless coppering bath.

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patent: 3783005 (1974-01-01), Kenney
patent: 3791340 (1974-02-01), Ferrara
patent: 3928670 (1975-12-01), Brummett et al.
patent: 3942983 (1976-03-01), Di Blas
patent: 3950570 (1976-04-01), Kenney
patent: 3959523 (1976-05-01), Grunwald et al.
patent: 3959547 (1976-05-01), Polichette et al.
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patent: 4084023 (1978-04-01), Dafter
patent: 4096043 (1978-06-01), De Angelo
patent: 4133908 (1979-01-01), Madsen
Giversen, "A Method of Depositing a Metal on a Surface", Western Electric Technical Digest, No. 51, Jul., 1978.

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