Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Subsequent separation into plural bodies
Patent
1999-03-26
2000-08-29
Monin, Jr., Donald L.
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
Subsequent separation into plural bodies
438459, 438401, 438975, 438977, 257797, H01L 2130, H01L 2146
Patent
active
061108065
ABSTRACT:
A method is described for fabricating a module having a chip attached to a carrier substrate, wherein a guide substrate transparent to ablation radiation is used. A removable layer is provided on a surface of the guide substrate. A first alignment guide is formed on the removable layer, and a second alignment guide is formed on a front surface of the chip. The chip is aligned to the guide substrate by contacting the second alignment guide to the first alignment guide; the chip is then attached to the guide substrate. The carrier substrate is attached to the chip at the back surface of the chip. The interface between the removable layer and the guide substrate is then ablated using radiation (typically laser radiation) transmitted through the guide substrate, thereby detaching the guide substrate. Thin films with metal interconnections may then be provided on the front surface of the chip.
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Anderson Jay H.
International Business Machines - Corporation
Monin, Jr. Donald L.
Peralta Ginette
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