Process for polishing a semiconductor device substrate

Details Process for polishing a semiconductor device substrate Process for polishing a semiconductor device substrate

1996-12-26

1999-06-29

Rose, Robert A.

Abrading

Abrading process

Glass or stone abrading

451 60, 451443, 451446, 451 57, 451287, B24B 724

Patent

active

059160110

ABSTRACT:
A polishing pad (34) with a poromeric structure polishes two dissimilar materials (56, 58). By using a relatively softer pad. and conditioning, relatively constant times can be used for polishing the dissimilar materials (56, 58). This makes polishing more predictable and increases the number of substrates that can be polished using a single polishing pad (34). Polishing pads (34) are typically changed when other maintenance is performed on the polisher rather than when the polishing rate becomes too low.

REFERENCES:
patent: 4841680 (1989-06-01), Hoffstein et al.
patent: 4927432 (1990-05-01), Budinger et al.
patent: 5064683 (1991-11-01), Poon et al.
patent: 5081051 (1992-01-01), Mattingly et al.
patent: 5222329 (1993-06-01), Yu
patent: 5308438 (1994-05-01), Cote et al.
patent: 5514245 (1996-05-01), Doan et al.
patent: 5527424 (1996-06-01), Mullins
Rodel, Inc. Polishing Pad Sales Literature 1994, Booklet (4 pgs.).

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