Process for plating solder

Details Process for plating solder Process for plating solder

1978-12-11

1980-09-02

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

204206, C25D 706, C25D 1712, C25D 1728

Patent

active

042205069

ABSTRACT:
An apparatus and process are described for plating tin-lead solder on metallic surfaces. Particularly significant is the high plating rate and the limited amount of plating in designated areas of the metallic surface. Solder is introduced into the plating solution from anode baskets holding tin-lead solder. This apparatus and process are particularly adaptable for continuous strip plating on metallic electrical connectors.

REFERENCES:
patent: 1864490 (1932-06-01), Harrison
patent: 3554878 (1971-01-01), Rothschild
patent: 4029555 (1977-06-01), Tezuka
patent: 4153523 (1979-05-01), Koontz

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