Process for plating polymeric substrates

Details Process for plating polymeric substrates Process for plating polymeric substrates

1980-05-01

1983-02-22

Douglas, Winston A.

Chemistry: electrical and wave energy

Processes and products

204 38B, 204 52R, C25D 556

Patent

active

043747094

ABSTRACT:
A process for pretreating a substantially non-conductive substrate such as a plateable plastic or plastic article having an electroless metal deposit on the surface thereof which comprises the steps of conditioning the surface of the substrate to effect an increase in the conductivity thereof with a dilute aqueous acidic solution containing controlled effective amounts of copper, acid and a polyether compound followed by an electrolytic acid copper strike employing a more concentrated aqueous electrolyte containing copper, acid and a polyether compound. The conditioning and electrolytic copper strike steps can be performed without necessitating any intervening rinse steps to provide a conductive basis for subsequently depositing adherent and uniform electroplates such as decorative acid copper or the like.

REFERENCES:
patent: 3328273 (1967-06-01), Creutz et al.
patent: 3682788 (1972-08-01), Kardos et al.
patent: 3751289 (1973-08-01), Arcilesi
patent: 3954570 (1976-05-01), Shirk et al.
Frederick Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 389-391, 410-415. _

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