Process for plating metals onto various substrates in an adheren

Details Process for plating metals onto various substrates in an adheren Process for plating metals onto various substrates in an adheren

1995-07-10

1996-08-20

Gorgos, Kathryn

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

205126, 205164, 205167, 205169, 205187, 205205, 205210, 205219, C25D 502, C25D 556, C25D 534, C23C 2802

Patent

active

055475590

ABSTRACT:
The invention described provides a process for direct electroplating on activated surfaces substantially without the formation of a smut layer and thereby improving the adhesion of the plated deposit to the surface. The use of divalent or tetravalent sulfur compounds and/or cathodic electrocleaning is proposed between activation of the surface and electroplating of the surface.

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