Process for plating a printed circuit board

Details Process for plating a printed circuit board Process for plating a printed circuit board

1989-12-18

1991-07-16

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

C25D 502

Patent

active

050322346

ABSTRACT:
A printed circuit board is plated through the steps of providing a printed circuit board, covering at least a predetermined portion to be plated of the printed circuit board with a mask, sealing tightly the periphery of the concavity by sandwiching a sealing material between the mask and the circuit board, providing an electric contact piece, filling up the space with plating solution, connecting the electric contact piece to a power supply, and supplying a plating electric current to the predetermined portion to be plated of the printed circuit board.

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