Process for plating a piezoelectric composite

Details Process for plating a piezoelectric composite Process for plating a piezoelectric composite

2006-08-01

2006-08-01

Tugbang, A. Dexter (Department: 3729)

Metal working

Piezoelectric device making

C029S594000, C029S842000, C029S846000, C029S841000, C205S125000, C205S162000, C216S052000, C216S057000, C204S192100, C310S340000, C310S358000

Reexamination Certificate

active

07082655

ABSTRACT:
A transducer having a ceramic element in which the ceramic is elevated above a polymer and a method of manufacturing the transducer. The transducer comprises a piezo-composite element comprising a ceramic element embedded in epoxy. In an array, the ceramic elements may be in the form of posts. The plurality of ceramic elements is slightly elevated above the polymer and in staggered arrangement with the polymer. The element is manufactured by first grinding the face of the composite and removing damaged ceramic by acid etching the ceramic. The epoxy is removed by plasma etching so that the ceramic is above the epoxy. The composite is sputter plated so that a maximum temperature that could damage the plating is not exceeded. The ceramic is then poled so that a maximum temperature that could damage the plating is not exceeded. Contacts are then attached to the plating adjacent the ceramic.

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