Process for plating a metallic deposit between functional patter

Details Process for plating a metallic deposit between functional patter Process for plating a metallic deposit between functional patter

1991-09-12

1993-05-25

Beck, Shrive

Coating processes

Direct application of electrical, magnetic, wave, or...

Polymerization of coating utilizing direct application of...

427437, 4274431, C23C 2600

Patent

active

052138500

ABSTRACT:
Disclosed is a process for plating a metallic deposit between functional pattern lines on a substrate, comprising (a) forming a cured film containing a catalyst for electroless plating on the substrate, (b) forming functional pattern lines on said cured film, and (c) conducting electroless plating.

REFERENCES:
patent: 4324589 (1982-04-01), Gulla
patent: 4383016 (1983-05-01), Postupack
patent: 4440847 (1984-04-01), Whittemore
patent: 4504529 (1985-03-01), Sorensen
patent: 4585502 (1986-04-01), Uozu
patent: 4859571 (1989-08-01), Cohen
patent: 4915985 (1990-04-01), Maxfield
patent: 4920254 (1990-04-01), DeCamp
IBM Technical Disclosure Bulletin, vol. 31, No. 5, Oct. 1988, pp. 370-372, New York, US; "Precatalyzed epoxy formulations for electroless plating".
RCA Technical Notes, No. 768, Apr. 1968, pp. 2-3; R. J. Ryan: "Printed circuit techniques".
Extended Abstracts, The Electrochemical Society, Inc. Fall Meeting Las Vegas, Nevada, Oct. 17th-22nd 1976, vol. 76-2, abstract No. 273; G. Messner: "imaging processes for electrolessly deposited conductors".

Affiliated with

Also associated with

Rating

Process for plating a metallic deposit between functional patter does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for plating a metallic deposit between functional patter, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for plating a metallic deposit between functional patter will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-896150