Process for plating a metallic deposit between functional patter

Coating processes – Direct application of electrical – magnetic – wave – or... – Polymerization of coating utilizing direct application of...

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

427437, 4274431, C23C 2600

Patent

active

052138500

ABSTRACT:
Disclosed is a process for plating a metallic deposit between functional pattern lines on a substrate, comprising (a) forming a cured film containing a catalyst for electroless plating on the substrate, (b) forming functional pattern lines on said cured film, and (c) conducting electroless plating.

REFERENCES:
patent: 4324589 (1982-04-01), Gulla
patent: 4383016 (1983-05-01), Postupack
patent: 4440847 (1984-04-01), Whittemore
patent: 4504529 (1985-03-01), Sorensen
patent: 4585502 (1986-04-01), Uozu
patent: 4859571 (1989-08-01), Cohen
patent: 4915985 (1990-04-01), Maxfield
patent: 4920254 (1990-04-01), DeCamp
IBM Technical Disclosure Bulletin, vol. 31, No. 5, Oct. 1988, pp. 370-372, New York, US; "Precatalyzed epoxy formulations for electroless plating".
RCA Technical Notes, No. 768, Apr. 1968, pp. 2-3; R. J. Ryan: "Printed circuit techniques".
Extended Abstracts, The Electrochemical Society, Inc. Fall Meeting Las Vegas, Nevada, Oct. 17th-22nd 1976, vol. 76-2, abstract No. 273; G. Messner: "imaging processes for electrolessly deposited conductors".

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for plating a metallic deposit between functional patter does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for plating a metallic deposit between functional patter, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for plating a metallic deposit between functional patter will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-896150

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.