Coating processes – Direct application of electrical – magnetic – wave – or... – Polymerization of coating utilizing direct application of...
Patent
1991-09-12
1993-05-25
Beck, Shrive
Coating processes
Direct application of electrical, magnetic, wave, or...
Polymerization of coating utilizing direct application of...
427437, 4274431, C23C 2600
Patent
active
052138500
ABSTRACT:
Disclosed is a process for plating a metallic deposit between functional pattern lines on a substrate, comprising (a) forming a cured film containing a catalyst for electroless plating on the substrate, (b) forming functional pattern lines on said cured film, and (c) conducting electroless plating.
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IBM Technical Disclosure Bulletin, vol. 31, No. 5, Oct. 1988, pp. 370-372, New York, US; "Precatalyzed epoxy formulations for electroless plating".
RCA Technical Notes, No. 768, Apr. 1968, pp. 2-3; R. J. Ryan: "Printed circuit techniques".
Extended Abstracts, The Electrochemical Society, Inc. Fall Meeting Las Vegas, Nevada, Oct. 17th-22nd 1976, vol. 76-2, abstract No. 273; G. Messner: "imaging processes for electrolessly deposited conductors".
Ishikawa Katsukiyo
Matsumura Akira
Ohata Masashi
Beck Shrive
Dang Vi Duong
Nippon Paint Co. Ltd.
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