Process for planarizing substrate surfaces for magnetic thin fil

Details Process for planarizing substrate surfaces for magnetic thin fil Process for planarizing substrate surfaces for magnetic thin fil

1995-03-27

1996-03-19

Utech, Benjamin

Coating processes

Electrical product produced

Metallic compound coating

427240, 427241, 4273762, 427377, 427384, B05D 512

Patent

active

055002439

ABSTRACT:
A process for forming dielectric thin film coating suitable for use in magnetic thin film heads includes the application of a spin-on-glass material on a substrate, the spinning of the substrate, the preheating of the substrate and thin film to remove the solvents in the spin-on-glass material, and the heating in a reducing or in an inert atmosphere of the film to provide a conversion to a SiO.sub.2 film. The reducing and the inert atmospheres permit carbon to be left in the film. The presence of the carbon improves structural properties of the thin films.

REFERENCES:
patent: 4459327 (1984-07-01), Wang
patent: 4619839 (1986-10-01), Lehrer
patent: 4676867 (1987-06-01), Elkins et al.
patent: 4849296 (1989-07-01), Haluska et al.
patent: 5202152 (1993-04-01), Giannelis et al.
patent: 5256443 (1993-10-01), Tomita

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