Process for placing single or multiple patterned layers of condu

Details Process for placing single or multiple patterned layers of condu Process for placing single or multiple patterned layers of condu

1987-06-02

1989-09-26

Robinson, Ellis P.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156234, 156235, 156241, 156249, 156267, 1562757, 156344, B32B 3100

Patent

active

048697672

ABSTRACT:
The invention consists of an improved method for placing single or multiple patterned layers of conductive material on a substrate. The method provided includes the step of placing or depositing a thin patterned layer of electrically conductive material on a substrate. The procedures used to deposit this layer include mechanically adhering the layer to the substrate then removing portions of it to form a pattern. They also include printing adhesive on the substrate and using it to peel a conductive pattern off of the surface of a transfer agent. After depositing the first conductive pattern, the process prints an insulating layer on top of it. The insulating layer has openings through which the next conductive pattern makes electrical contact with the first. Similarly, the process places other conductive layers and prints other insulating layers between them to produce multiple layers of conductive patterns. The multilayer circuit board provided includes a substrate. It also includes conductive layers separated by insulating layers and electrically interconnected through openings in those insulating layers.

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