Process for peeling protective film off a wafer

Details Process for peeling protective film off a wafer Process for peeling protective film off a wafer

1988-11-28

1991-04-23

Ball, Michael W.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156249, 156344, 156584, B32B 3118

Patent

active

050097350

ABSTRACT:
A process for peeling a protective film stuck to an upper-side of a wafer is disclosed. The protective film is peeled by adhering an adhesive tape to the upper side of the rear end of said protective film stuck on the wafer by means of a press roller, lifting the press roller and sliding said press roller forward, sliding a peeling unit forward to peel the adhesive tape together with the protective film by utilizing the adhesive force of the adhesive tape. The wafer is prevented from being damaged.

REFERENCES:
patent: 4285759 (1981-08-01), Allen et al.
patent: 4631103 (1986-12-01), Ametani
patent: 4732642 (1988-03-01), Ametani
patent: 4770737 (1988-09-01), Seki

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