Process for patterned electroplating

Details Process for patterned electroplating Process for patterned electroplating

1995-04-06

1996-08-13

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

430320, C25D 502

Patent

active

055453074

ABSTRACT:
A process for patterned electroplating involves the steps of: (i) coating a substrate with a layer of amninoalkylpyridine which acts as an adhesion promoter; (ii) coating the adhesion layer with a radiation sensitive polymeric resist; (iii) imagewise exposing the film to radiation; (iv) developing the image to patternwise expose the substrate; (v) electroplating metal onto the exposed portions of the substrate; and (vi) removing the remaining polymeric film from the substrate.

REFERENCES:
patent: 4279707 (1981-07-01), Anderson et al.
patent: 4652954 (1987-03-01), Church
patent: 4681814 (1987-07-01), Leidheiser, Jr. et al.
patent: 4875124 (1989-10-01), Dickstein et al.
patent: 5143884 (1992-09-01), Skoultchi et al.
patent: 5272026 (1993-12-01), Roland et al.
Nepala, D. A., "Aromatic Azo Compounds as Electrophotographic Sensitizers", IBM Technical Disclosure Bulletin, vol. 11, No. 12, May 1969.
Haines, R. S., "Magnetic Tape", IBM Technical Disclosure Bulletin, vol. 2, No. 4, Dec. 1959.
Lewis, Sr., R. J., Hawley's Condensed Chemical Dictionary, Twelfth Edition (1993) Month not available.
Moreau, W. M., "Semiconductor Lithography Principles, Practices and Materials", Plenum Press, New York, 1988 Month not available.
Mittal, K. L. et al., "Vapor Deposited Adhesion Promoters", IBM Technical Disclosure Bulletin, vol. 17, No. 12, May 1975.
Romankiw, R. et al., "Magnetic Materials, Processes and Devices", Electrochemical Society, Inc., vol. 90-8, date unavailable.
Christenson, T. R., et al., "Micromechanics for Actuators", SPIE vol. 2220, pp. 39-47, date unavailable.
Lochel, B. et al., "Galvanoplated 3D Structures for Micro Systems", Microelectronic Engineering 23 (1994) 455-459, Elsevier. Month not available.
Gobet, J. et al., "Electrodeposition of 3D Microstructures on Silicon", J. Micromech. Microeng. 3 (1993), 123-130. Month not available.
Gau, J.-S., "Photolithography for Integrated Thin Film Read/Write Heads", SPIE vol. 1088 Optical/Laser Microlithography II (1989). Month not available.
Phillips, W. A. et al., "Fluid Control Devices", IEE Colloquium (Digest) n 069 Mar. 15, 1994.
Lochel, B., "Fabrication of Magnetic Microstructures by Using Thick Layer Resists", Microelectronic Engineering 21 (1993) 463-466. Month not available.

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