Process for partially electroplating flat silver

Chemistry: electrical and wave energy – Processes and products

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Details

76104R, 204 38R, C25D 500, C25D 502, B21K 1102

Patent

active

042971756

ABSTRACT:
A process for partially silver electroplating the metal surface of a flat silver part wherein part of the surface is covered prior to silvering with a plating-resistant dipping enamel. A separation surface is provided between the exposed surface of the part to be covered with the dipping enamel and the exposed surface of the lengthwise adjacent part to be silvered. The separation surface consists of a material which is more difficult to wet with the dipping enamel than the metal of the surface to be covered. Preferably, the separation surface is the peripheral surface of a spacer lamination composed of polytetrafluoroethylene.

REFERENCES:
patent: 1526644 (1925-02-01), Pinney
patent: 2165991 (1939-07-01), West
patent: 3481038 (1969-12-01), Cooper

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