Process for obtaining high barrier Schottky diode and local inte

Fishing – trapping – and vermin destroying

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437 39, 437178, 437200, H01L 21265, H01L 2170

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active

053209710

ABSTRACT:
This invention is a silicon bipolar integrated circuit comprising: a high barrier Schottky diode clamp on a bipolar transistor, the diode clamp comprising a self-aligned PtSi layer on a silicon surface; and a TiN local interconnect partially overlying the PtSi layer. It also is a method of manufacturing an integrated circuit comprising: forming a self-aligned PtSi layer on the adjacent base and collector silicon regions, the PtSi serving as a clamp diode on the bipolar transistor; and forming an etch-patterned TiN layer partially overlying the PtSi layer, the etch-patterned TiN layer serving as local interconnects. The invention provides a PtSi Schottky diode on a bipolar transistor in combination with a TiN local interconnect with the advantages of (i) providing a TiN local interconnect which can be etched without also etching the PtSi, (ii) permitting a wide process window for overetching at contacts, (ii) a TiN local interconnect which is an improvement over a polysilicon local interconnect, and (iv) a high barrier Schottky diode for clamping a bipolar transistor.

REFERENCES:
patent: 4800177 (1989-01-01), Nakamae
patent: 4809052 (1989-02-01), Nishioka et al.
patent: 4978637 (1990-12-01), Liou et al.
patent: 4988423 (1991-01-01), Yamamoto et al.
M. Eizenberg et al., "Shallow silicide contacts formed by using codeposited Pt.sub.2 Si and Pt.sub.1.2 Si films", Appl. Phys. Lett. 37(6), Sep. 15, 1980, pp. 547-549.

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