Process for mounting components on a base by means of thixotropi

Details Process for mounting components on a base by means of thixotropi Process for mounting components on a base by means of thixotropi

1977-06-03

1979-03-20

Pavelko, Thomas P.

Plastic and nonmetallic article shaping or treating: processes

Treatment of material by vibrating, jarring, or agitating...

29626, 156 736, B29C 2700

Patent

active

041453905

ABSTRACT:
The invention relates to a process for mounting in particular electronic components on a base by means of thixotropic material whereby the material is transferred to the base by dipping a die and the component in a stock and then pressing the component on the material layer thus produced whereby the dipping and/or pressing motion of the die or the component is superimposed by a vibration for liquidefying the thixotropic material.

REFERENCES:
patent: 3516155 (1970-06-01), Smith
patent: 3561107 (1971-02-01), Best

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