Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent
1997-09-15
1998-12-08
Graybill, David
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
438122, 438125, 29 2501, H01L 2152, H01L 2158
Patent
active
058468528
ABSTRACT:
The electronic component (10) has a die (22) and a terminal (14) coupled to the die (22). The substrate has a first side (20) and a second side (82) and a passage (26) therethrough. The terminal (14) is in communication with the first side (20) and the die (22) is disposed within the passage (26). The apparatus includes a cover (16) which encloses the die (22) and a portion of the terminal (14), and has a fixed portion (28) and a removable portion. The fixed portion (28) includes a connection region coupled to the terminal (14) and an extension region disposed within the passage (26). The extension region has a surface that is substantially coplanar with the second side (82). There is a space (32) between the extension region and the substrate (18). An adhesive (34) is disposed on the surface of the extension region, extending into the space (32). A sealing frame (36) overlaps the space (32) and is in communication with the adhesive (34) and the second side (82).
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Limper-Brenner Linda
McDunn Kevin J.
Press Minoo D.
Schmidt Detlef W.
Creps Heather L.
Graybill David
Motorola Inc.
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