Process for molding epoxy resins with coarse decorative particle

Plastic and nonmetallic article shaping or treating: processes – Mechanical shaping or molding to form or reform shaped article – Shaping against forming surface

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

2643289, 26432813, 26432818, B29C 4534, B29K10516

Patent

active

055230440

ABSTRACT:
The present invention provides a process for the manufacture of a moulded article which comprises introducing a curable epoxy resin composition to a mould which is at a temperature high enough to initiate curing of the resin and supplying further resin under pressure to compensate for shrinkage of the composition, the epoxy resin containing coarse decorative particles therein, wherein the epoxy resin is introduced into the mould through a gap having a length which is 30 to 100% of that dimension of the moulded product being made which is adjacent to the gap and a width which is at least twice the maximum size of the decorative particles.

REFERENCES:
Derwent 80-79920 c.
Patent Abstracts of Japan (57-63235 (A)).

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Process for molding epoxy resins with coarse decorative particle does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for molding epoxy resins with coarse decorative particle, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for molding epoxy resins with coarse decorative particle will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-381422

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.