Process for molding acetylene end-capped polyimide oligomers

Details Process for molding acetylene end-capped polyimide oligomers Process for molding acetylene end-capped polyimide oligomers

1978-11-24

1980-09-30

Thurlow, Jeffery R.

Plastic and nonmetallic article shaping or treating: processes

Disparate treatment of article subsequent to working,...

Effecting temperature change

264331, 264347, 528126, 528128, B29C 2500

Patent

active

042255503

ABSTRACT:
Fine particles of acetylene end-capped polyimide oligomers are copression-molded at ambient temperature. The preformed moldings are cured without melting the resin by heating to an elevated temperature which is lower than the oligomer's melting point.

REFERENCES:
patent: 3413394 (1968-11-01), Jordan
patent: 3439082 (1969-04-01), Riley
patent: 3845018 (1974-10-01), Bilow et al.
patent: 3879349 (1975-04-01), Bilow et al.
patent: 4108836 (1978-08-01), Bilow

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