Process for modifying structural profiles in resist layers

Details Process for modifying structural profiles in resist layers Process for modifying structural profiles in resist layers

1985-05-13

1987-06-09

Birmiel, Howard A.

Radiation imagery chemistry: process, composition, or product th

Use of sound or nondigital compressive force

430328, G03F 700, G03F 702, G03F 726

Patent

active

046720120

ABSTRACT:
A process for modifying structural profiles produced by polymerization or depolymerization in resist layers. As a function of the acoustic impedance of the substrate carrying the resist layer, the structures are irradiated with an ultrasonic beam. An ultrasonic beam for which the substrate represents a high impedance is used in order to enhance the contrast of the structures. An ultrasonic beam for which the substrate represents a low impedance is used to weaken the contrast. An acoustic microscope is especially suitable for carrying out the process.

REFERENCES:
patent: 3962004 (1976-06-01), Sonneborn

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