Process for metallizing non-conductive substrates

Details Process for metallizing non-conductive substrates Process for metallizing non-conductive substrates

1989-03-29

1990-12-11

Beck, Shrive

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427304, 427305, 427306, 427 97, C23C 2600

Patent

active

049769901

ABSTRACT:
Non-conductive surfaces, particularly through-hole surfaces in double-sided or multi-layer printed circuit board, are treated (conditioned) to receive void-free, adherent electroless metal coatings by contact of the surfaces with an organosilane preparatory to catalyzation and metallization.

REFERENCES:
patent: 3978252 (1976-08-01), Lombardo
patent: 4259409 (1981-03-01), Arnold
patent: 4425380 (1984-01-01), Nuzzi
patent: 4515829 (1985-05-01), Deckert
patent: 4597988 (1986-07-01), Kukanskis
patent: 4608275 (1986-08-01), Kukanskis
patent: 4629636 (1986-12-01), Courduvelis
patent: 4748104 (1988-05-01), Ferrier
Peter E. Kukanskis et al., "Improved Chemistry For Through-Hole Plating of Printed Circuit Boards" World Printed Circuit Conference June 1987.
Jeffrey J. Doubrava "The Black Hole and Beyond the Production of Void-Free Plated Through-Holes" PCFAB Aug. 1985 pp. 14, 19, 20, 22, 27-29.

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