Process for metallizing a ceramic substrate

Details Process for metallizing a ceramic substrate Process for metallizing a ceramic substrate

1989-01-12

1990-04-03

Niebling, John F.

Chemistry: electrical and wave energy

Processes and products

204 30, 204321, 204 384, 427305, 427309, C25D 554, C23C 1818

Patent

active

049137840

ABSTRACT:
An improved process for metallizing a ceramic substrate for the purpose of producing a metal layer having uniformly good adhesion as measured by peel strength. The improvement is a pretreatment process in which the firing skin, i.e., the glass-like surface of the ceramic substrate is removed and the exposed surface of the ceramic substrate is positively roughened. The pretreatment includes a chemical etching step during which the ceramic substrate contacts a melt bath containing molten alkali hydroxide and an additive, which additive preferably is water. From 0.01 to 80 weight %, preferably from 1 to 5 weight %, of water is included in the melt bath. Rather than reducing the etching rate because of dilution, the rate increased unexpectedly. Moreover, the metallization resulted in a metal layer having very good adhesion, which adhesion can be further improved by chemically etching the ceramic substrate under a protective gas atmosphere, preferably a wet protective gas atmosphere.

REFERENCES:
patent: 4135012 (1979-01-01), Su
patent: 4428986 (1984-01-01), Schachameyer
patent: 4430170 (1984-02-01), Stern
patent: 4631114 (1986-12-01), Schneider
patent: 4647477 (1987-03-01), DeLuca
patent: 4666744 (1987-05-01), DeLuca et al.
H. Silman et al, Protective and Decorative Coatings for Metals, Finishing Publications, Ltd., Teddington, Middlesex, England, 1978, pp. 140-141.
F. A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, 1978, pp. 99-112.
A. Kenneth Graham, Electroplating Engineering Handbook, Reinhold Publishing Corp., New York, 1962, pp. 716-721.

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