Process for metallized vias in polyimide

Details Process for metallized vias in polyimide Process for metallized vias in polyimide

1993-03-29

1995-03-14

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437247, 437235, 437228, H01L 21283

Patent

active

053977416

ABSTRACT:
A process for producing a plurality of metallized vias in a polyimide dielectric is disclosed. The process includes depositing a polyimide precursor, then a silane and finally a metal, after patterning the polyimide and silane. The sandwich is heated to completely imidize the polyimide, crosslink the silane and anneal the metal simultaneously. The excess metal overlying the polyimide between the vias is removed by chemical mechanical polishing using the crosslinked silane as a polish stop.

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