Process for metallization of dielectric substrate through holes

Details Process for metallization of dielectric substrate through holes Process for metallization of dielectric substrate through holes

1984-04-26

1985-10-01

Newsome, John H.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 531, 427205, 427229, 427230, 427238, B05D 512

Patent

active

045445770

ABSTRACT:
A method of metallizing through holes in dielectric substrates with a metallizing material comprising forming a hole in the substrate utilizing laser techniques, depositing a layer of a dielectric on the side wall of the hole and then depositing a layer of a metallizing material onto the dielectric layer.

REFERENCES:
patent: 2798577 (1957-07-01), LaForge
patent: 3357856 (1967-12-01), Ragan et al.
patent: 4020206 (1977-04-01), Bell
patent: 4024629 (1977-05-01), Lemoine et al.
patent: 4047290 (1977-09-01), Weitze et al.
patent: 4131516 (1978-12-01), Bakos et al.
patent: 4170819 (1979-10-01), Peter et al.
patent: 4301192 (1981-11-01), Plichta

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