Process for metallization of a substrate by irradiative curing o

Details Process for metallization of a substrate by irradiative curing o Process for metallization of a substrate by irradiative curing o

1997-12-08

1999-11-23

Talbot, Brian K.

Coating processes

Direct application of electrical, magnetic, wave, or...

Pretreatment of substrate or post-treatment of coated substrate

427554, 427555, 427558, 427557, 427581, 427597, B05D 300

Patent

active

059896531

ABSTRACT:
An improved additive process for metallization of substrates is described whereby a catalyst solution is applied to a surface of a substrate. Metallic catalytic clusters can be formed in the catalyst solution on the substrate surface by irradiating the substrate. Electroless plating can then deposit metal onto the portion of the substrate surface having metallic clusters. Additional metallization thickness can be obtained by electrolytically plating the substrate surface after the electroless plating step.

REFERENCES:
patent: 4981715 (1991-01-01), Hirsch et al.
patent: 5153023 (1992-10-01), Orlowski et al.
patent: 5192581 (1993-03-01), Hirsch et al.
patent: 5348574 (1994-09-01), Tokas et al.

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