Process for metallization of a nonconductor surface, especially

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating a substrate predominantly comprised of nonconductive...

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205167, 205187, 205920, C25D 554, C25D 1134

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active

051835525

ABSTRACT:
The process for directly metallizing a circuit board having nonconductor surfaces, includes reacting the nonconductor surface with an alkaline permanganate solution to form manganese dioxide chemically adsorbed on the nonconductor surface; forming an aqueous solution of a weak acid having an acid dissociation constant, for loss of a proton in aqueous solution, between 0.1 and 0.01, and of pyrrole or a pyrrole derivative and soluble oligomers thereof; contacting the aqueous solution containing the pyrrole monomer and its oligomers with the nonconductor surface having the manganese dioxide adsorbed chemically thereon to deposit an adherent, electrically conducting, insoluble polymer product on the nonconductor surface; and directly electrodepositing metal on the nonconductor surface having the insoluble adherent polymer product formed thereon. The oligomers are advantageously formed in aqueous solution containing 0.1 to 200 g/l of the pyrrole monomer at a temperature between room temperature and the freezing point of the solution.

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Lowenheim, F. A. "Electroplating"; McGraw-Hill, NY, NY, 1978, pp. 416-417.

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