Process for metallization of a nonconductor surface

Details Process for metallization of a nonconductor surface Process for metallization of a nonconductor surface

1995-08-23

1997-12-02

Gorgos, Kathryn L.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating predominantly nonmetal substrate

205183, 205125, 205920, C25D 556

Patent

active

056932090

ABSTRACT:
The process for directly metallizing a circuit board having nonconductor surfaces, includes reacting the nonconductor surface with an alkaline permanganate solution to form manganese dioxide chemically adsorbed on the nonconductor surface; forming an aqueous solution of a weak acid and of pyrrole or a pyrrole derivative and soluble oligomers thereof; contacting the aqueous solution containing the pyrrole monomer and its oligomers with the nonconductor surface having the manganese dioxide adsorbed chemically thereon to deposit an adherent, electrically conducting, insoluble polymer product on the nonconductor surface; and directly electrodepositing metal on the nonconductor surface having the insoluble adherent polymer product formed thereon. The oligomers are advantageously formed in aqueous solution containing 0.1 to 200 g/l of the pyrrole monomer at a temperature between room temperature and the freezing point of the solution.

REFERENCES:
patent: 4567250 (1986-01-01), Naarmann et al.
patent: 4869949 (1989-09-01), Muenstedt
patent: 5183552 (1993-02-01), Bressel et al.

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