Process for metal plating on aluminum and aluminum alloys

Chemistry: electrical and wave energy – Processes and products

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204 38A, 204 42, 204 33, C25D 544, C25D 550

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active

041152115

ABSTRACT:
Metal plated aluminum product with good adhesion between aluminum substrate and plated metal are found to be producible by the process which comprises: electrolyzing aluminum or aluminum alloys by A.C. or superimposed A.C. and D.C. in an electrolytic solution capable of producing a growth type or barrier type anodic oxide coating onto the surface of the aluminum or aluminum alloy and comprising an aqueous solution containing a water-soluble acid and a water-soluble heavy metal salt, thereby to impart good adhesion properties to the aluminum or aluminum alloy surface and render it suitable as a substrate for plating of additional metal thereon, metal plating on the resulting aluminum substrate, and subjecting said plated substrate to a heat treatment to enhance the adhesion between the substrate and the additional metal plated thereon.

REFERENCES:
patent: 2578400 (1951-12-01), Cohn
patent: 2637686 (1953-05-01), McKay
patent: 2965551 (1960-12-01), Richaud
patent: 2970090 (1961-01-01), Withers et al.
patent: 3468765 (1969-09-01), McConnell
patent: 3493474 (1970-02-01), Weber et al.
patent: 3531379 (1970-09-01), Peach
patent: 3717555 (1973-02-01), Chakravarti et al.

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