Process for metal deposition for microelectronic interconnection

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate

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427534, 427 96, 427 98, 427 99, 427123, 427124, 427125, 427250, 427252, 437186, 437187, 437189, 437192, 437195, 437229, 437231, B05D 512, C23C 1606, H01L 21314

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052925587

ABSTRACT:
A method for forming interconnections in microelectronic devices, including interconnections through small vias between different layers in the microelectronic devices include the spin coating of a film comprising a polyoxometalate and an organic material on the substrate. The film is optionally patterned by lithography, the polymer is removed, and the polyoxometalate is reduced to a metal layer. The metal layer may in one embodiment provide a nucleating zone for the deposition of metal.

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