Process for manufacturing through-hole contacting plated printed

Details Process for manufacturing through-hole contacting plated printed Process for manufacturing through-hole contacting plated printed

1991-12-09

1992-09-08

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Treating substrate prior to coating

205210, 205184, 205187, 29852, C25D 534

Patent

active

051455722

ABSTRACT:
The process for manufacturing through-hole contacting plated printed circuit boards by direct metal electrodeposition on catalytically activated surfaces of the substrate material is improved by pre-treatment prior to electrodepositing the metal, preferably with a solution containing one or more nitrogen-containing organic compounds.

REFERENCES:
patent: 3099608 (1963-07-01), Radovsky et al.
patent: 3194681 (1965-07-01), Nicholson et al.
patent: 4622108 (1986-11-01), Polakovic et al.
patent: 4683036 (1987-07-01), Morrissey et al.
patent: 4749449 (1988-06-01), Scott
patent: 4891069 (1990-01-01), Holtzman et al.
patent: 4895739 (1990-01-01), Bladon
Lowenheim, F. A., "Electroplating", McGraw-Hill, New York, 1978, pp. 78-79.

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