Process for manufacturing semiconductor packages comprising an i

Details Process for manufacturing semiconductor packages comprising an i Process for manufacturing semiconductor packages comprising an i

1998-06-03

2000-07-11

Monin, Jr., Donald L.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438110, 438114, 438124, 438127, 438460, 438464, H01L 2144

Patent

active

060872020

ABSTRACT:
A process for manufacturing semiconductor packages comprising, respectively, a substrate, a chip which forms an integrated circuit and is attached to one region of the substrate, electrical connection means connecting the chip to a group of external electrical connection regions lying on one face of the substrate, as well as an encapsulation encasement. The process consists in producing, in a matrix configuration, a multiplicity of groups of connection regions (104a) on a common substrate plate (102), corresponding to as many chip attachment regions (109), in attaching a chip (103) to each attachment region (109) of the common substrate plate, in electrically connecting each chip (103) to the associated electrical connection regions (104a), so as to obtain an assembly (111) consisting of the substrate plate and the connected chips. The process consists, in a second step, in placing this assembly (111) in a mold (112) and in injecting an encasement material (106) into the mold so as to obtain, in a single molding operation, a parallelepipedal block (117) and then, in a subsequent step, in cutting the said parallelepipedal block (117) through its thickness into units, each constituting a semiconductor package.

REFERENCES:
patent: 5273938 (1993-12-01), Lin et al.
patent: 5652185 (1997-07-01), Lee
patent: 5731231 (1998-03-01), Miyajima
patent: 5830800 (1998-11-01), Lin
patent: 5832600 (1998-11-01), Hashimoto
patent: 5937512 (1999-08-01), Lake et al.
patent: 5950070 (1999-09-01), Razon et al.
patent: 5989982 (1999-11-01), Yoshikazu

Affiliated with

Also associated with

Rating

Process for manufacturing semiconductor packages comprising an i does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for manufacturing semiconductor packages comprising an i, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for manufacturing semiconductor packages comprising an i will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-541594