Process for manufacturing semiconductor integrated circuit devic

Details Process for manufacturing semiconductor integrated circuit devic Process for manufacturing semiconductor integrated circuit devic

1992-12-22

1994-04-19

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437209, 437212, 437214, 437216, 437217, 437219, 26427211, 26427214, 26427217, H01L 2160

Patent

active

053045122

ABSTRACT:
A chip 12 having an electric circuit and a plurality of leads 8 connected electrically with the chip 12 are molded in a resin-sealed package 46 by a molding material containing a main component of a resin, by introducing a molding compound sheet 20 into the cavities 33 of molds 31, 32 before the molds are clamped, by melting the molding compound sheet 20 in the cavities 33 into a liquid molding material 45 after the mold clamping action to pressure fill up the inside of the cavities 33, and by setting the liquid molding material 45 integrally.

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