Process for manufacturing semiconductor devices separated by an

Details Process for manufacturing semiconductor devices separated by an Process for manufacturing semiconductor devices separated by an

1996-04-26

1998-01-06

Graybill, David

Fishing, trapping, and vermin destroying

437206, 437226, 437227, H01L 21283, H01L 2158, H01L 2160, H01L 2170

Patent

active

057054258

ABSTRACT:
A process for manufacturing a semiconductor device comprising: a substrate having an insulating layer and a semiconductor layer lying on the insulating layer, the semiconductor layer having been divided to form a plurality of isolated semiconductor lands by trenches extending through the semiconductor layer to the insulating layer; integrated circuits formed on the respective lands; and conductors running above and across the trenches to electrically connect the integrated circuits on the isolated semiconductor lands.

REFERENCES:
patent: 3761782 (1973-09-01), Youmans
patent: 3787710 (1974-01-01), Cunningham
patent: 3890632 (1975-06-01), Ham et al.
patent: 3961354 (1976-06-01), Kuwagata et al.
patent: 4073055 (1978-02-01), Kimura et al.
patent: 4478655 (1984-10-01), Nagakubo et al.
patent: 4693758 (1987-09-01), Kobayashi et al.
patent: 4721682 (1988-01-01), Graham et al.
patent: 4764804 (1988-08-01), Sahara et al.
patent: 4966865 (1990-10-01), Welch et al.
patent: 5036021 (1991-07-01), Goto
patent: 5104820 (1992-04-01), Go et al.
patent: 5146308 (1992-09-01), Chance et al.
patent: 5559048 (1996-09-01), Inoue

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