Process for manufacturing printed-circuit boards having rigid an

Details Process for manufacturing printed-circuit boards having rigid an Process for manufacturing printed-circuit boards having rigid an

1990-01-16

1992-03-31

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156257, 156268, 29829, 29830, 29835, 361398, 428901, B32B 3118

Patent

active

051004925

ABSTRACT:
In a process for manufacturing printed-circuit boards which have rigid and flexible areas or internal layers of printed-circuit boards, a piece of the surface is punched out to form a window in every area of the insulating layer material which is to be flexible. The punched out piece is reinserted into the punched-out window as a filling piece before laminating the compound of individual layers.

REFERENCES:
patent: 4338149 (1982-07-01), Quaschner
patent: 4800461 (1989-01-01), Dixon et al.
patent: 4872934 (1989-10-01), Kameda

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