Process for manufacturing printed circuit boards

Details Process for manufacturing printed circuit boards Process for manufacturing printed circuit boards

1997-11-07

1999-12-21

Talbot, Brian K.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

427 99, 427124, 427282, 427300, 427405, B05D 512

Patent

active

060046198

ABSTRACT:
Process for manufacturing circuit boards in which a masking layer (2) is applied to a carrier substrate (1) of insulating material and after producing openings for soldering pads, conductor traces, and through or blind holes, in accordance with a preferred embodiment by laser ablation, a thin electrically conductive layer (5) is applied to the surface of the carrier substrate including the masking layer. Subsequently, the masking layer (2) and the conductive layer deposited thereon, for example copper, are removed and the remaining metal surfaces (6) are chemically reinforced to produce the desired thickness. The process permits the production of dense structures using few process steps and without additional abrasion steps.

Affiliated with

Also associated with

Rating

Process for manufacturing printed circuit boards does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Process for manufacturing printed circuit boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Process for manufacturing printed circuit boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-502618