Process for manufacturing plastic pin grid arrays and the produc

Details Process for manufacturing plastic pin grid arrays and the produc Process for manufacturing plastic pin grid arrays and the produc

1987-05-21

1989-03-28

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437211, 437219, 437215, 26427211, 439 69, 439 75, 174 524, 174 522, H01L 2302

Patent

active

048164267

ABSTRACT:
A process for forming an integral circuit pin grid array package comprising a flexible metal tape adapted for use in tape automated bonding with a plurality of holes. Terminal pins are inserted in the holes and the tape and pins are disposed within a mold so that a cavity is formed about the pins and tape. The cavity is filled with a polymer resin so as to at least partially surround and support the pins and tape and thereby form the plastic encapsulated pin grid array.

REFERENCES:
patent: Re32540 (1987-11-01), Murphy
patent: 4521469 (1985-06-01), Butt et al.
patent: 4525422 (1985-06-01), Butt et al.
patent: 4549651 (1985-10-01), Alemanni
patent: 4552422 (1985-11-01), Bennett et al.
patent: 4582556 (1986-04-01), Butt et al.
patent: 4618739 (1986-10-01), Theobald
patent: 4677526 (1987-06-01), Muehling
patent: 4688152 (1987-08-01), Chia
patent: 4696526 (1987-09-01), Newton et al.
patent: 4706811 (1987-11-01), Jung et al.
How To Make Pin-Grid Arrays at Half The Cost, by Jerry Lyman, published in the Feb. 19, 1876 Issue of Electronics at p. 36.
Composite-Type Pin Grid Array Package, by K, Tsutsumi et al., published in the Dec. 1986 Issue of IEEE Transactions on Components, Hybrids, and Manufacuting Technology, vol. CHMT-9, No. 4 at p. 336.

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