Process for manufacturing plastic pin grid arrays and the produc

Fishing – trapping – and vermin destroying

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Details

437215, 174 5051, 206331, 206347, 361400, H01L 2156

Patent

active

049652273

ABSTRACT:
A process for forming an integrated circuit pin grid array package comprising a flexible metal tape adapted for use in tape automated bonding with a plurality of holes. Terminal pins are inserted in the holes and the tapes and pins are disposed within a mold so that a cavity is formed about the pins and tape. The cavity is filled with a polymer resin so as to at least partially surround and support the pins and tape and thereby form the plastic encapsulated pin grid array.

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