Process for manufacturing optical and semiconductor elements

Details Process for manufacturing optical and semiconductor elements Process for manufacturing optical and semiconductor elements

2004-10-29

2008-07-29

Nguyen, Dung Van (Department: 3723)

Abrading

Abrading process

Combined abrading

C451S041000

Reexamination Certificate

active

07404756

ABSTRACT:
A method for fabricating an array of precisely shaped and located shaped elements utilizes a precisely shaped patterned abrasive to form channels in a workpiece. One or more patterned abrasives contact and abrade along one or more intersecting axes to define the shaped elements. The shaped elements may include optical elements, semiconductor elements, or both.

REFERENCES:
patent: 2865082 (1958-12-01), Gates
patent: 3187606 (1965-06-01), Ohntrup
patent: 3254558 (1966-06-01), Staunton
patent: 3383760 (1968-05-01), Shwartzman
patent: 4198788 (1980-04-01), Fleetwood et al.
patent: 4637370 (1987-01-01), Ishizuka
patent: 5107626 (1992-04-01), Mucci
patent: 5117592 (1992-06-01), Preston
patent: 5265381 (1993-11-01), Takahashi
patent: 5270423 (1993-12-01), Brown et al.
patent: 5379554 (1995-01-01), Thurman et al.
patent: 5698452 (1997-12-01), Goossen
patent: 5733178 (1998-03-01), Ohishi
patent: 5752874 (1998-05-01), Meyer, Jr. et al.
patent: 5915193 (1999-06-01), Tong et al.
patent: 5919561 (1999-07-01), Fuchs et al.
patent: 5925898 (1999-07-01), Spath
patent: 5958794 (1999-09-01), Bruxvoort et al.
patent: 5989111 (1999-11-01), Lamphere et al.
patent: 6243199 (2001-06-01), Hansen et al.
patent: 6412971 (2002-07-01), Wojnarowski et al.
patent: 6475398 (2002-11-01), Kitahata
patent: 6495862 (2002-12-01), Okazaki et al.
patent: 6563133 (2003-05-01), Tong
patent: 6634929 (2003-10-01), Visser
patent: 6671443 (2003-12-01), Deliwala
patent: 7008080 (2006-03-01), Bachl et al.
patent: 2002/0141006 (2002-10-01), Pocius et al.
patent: 2003/0024169 (2003-02-01), Kendall et al.
patent: 2003/0227678 (2003-12-01), Lines et al.
patent: 2003/0231497 (2003-12-01), Sakata et al.
patent: 2004/0012957 (2004-01-01), Bachi et al.
patent: 2004/0036080 (2004-02-01), Bogner et al.
patent: 2004/0046179 (2004-03-01), Baur et al.
patent: 1 080 836 (2001-03-01), None
patent: 10-151549 (1998-06-01), None
patent: WO 01/18570 (2001-03-01), None
patent: 01/41219 (2001-06-01), None
patent: 01-41225 (2001-06-01), None
patent: WO 01/45903 (2001-06-01), None
Q. Y. Tong, “Semiconductor Wafer Bonding”, John Wiley & Sons, New York, 1999, Table of Contents, pp. 49-101, and pp. 223-232.
U.S. Application entitled “Process for Manufacturing a Light Emitting Array”, filed on, Oct. 29, 2004, having U.S. Appl. No. 10/977,240.
IBM Technical Bulletin, vol. 15, NN7206147, “Method of Making Hemispheres”, Jun. 1972, pp. 147-148.

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