Process for manufacturing multilayer printed wiring board

Details Process for manufacturing multilayer printed wiring board Process for manufacturing multilayer printed wiring board

1990-02-06

1992-05-26

Aftergut, Jeff H.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156289, 156323, 174259, B32B 3120

Patent

active

051164400

ABSTRACT:
In manufacturing multilayer printed wiring boards with a cavity for mounting an electronic device, a rubber or composite rubber sheet is mounted in the cavity to prevent a prepreg resin from flowing into the cavity. The rubber sheet or composite rubber sheet is removed after applying pressure and temperature to an assembly consisting of boards to be bonded and the prepreg between them. This eliminates poor bonding which can result when resin flows into the cavity.

REFERENCES:
patent: 3840424 (1974-10-01), Morrison
patent: 4636275 (1987-01-01), Norell
patent: 4680075 (1987-07-01), McNeal et al.
patent: 4737208 (1988-04-01), Bloechle et al.

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