Process for manufacturing micromechanical devices containing...

Details Process for manufacturing micromechanical devices containing... Process for manufacturing micromechanical devices containing...

2006-11-28

2010-11-16

Nguyen, Ha Tran T (Department: 2829)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Having enclosed cavity

C438S473000, C438S106000, C438S118000, C438S119000, C438S125000

Reexamination Certificate

active

07833880

ABSTRACT:
A process is provided for manufacturing micromechanical devices formed by joining two parts together by direct bonding. One of the parts (12) is made of silicon and the other one is made of a material chosen between silicon and a semiconductor ceramic or oxidic material. The joint between the two parts forms a cavity (14) containing the functional elements of the device (11), possible auxiliary elements and a getter material deposit (13).

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