Process for manufacturing metal ball electrodes for a semiconduc

Details Process for manufacturing metal ball electrodes for a semiconduc Process for manufacturing metal ball electrodes for a semiconduc

1994-06-06

1999-01-19

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

438615, 22818022, H01L 21288, H01L 2158, H01L 2160

Patent

active

058613234

ABSTRACT:
Process for manufacturing arrays of metal balls for interconnect testing and/or interconnect bonding of microelectronic devices and the like with substrates are formed by securing metal balls in predetermined patterns of apertures in an insulating membrane or film. The pattern of apertures corresponds with the pattern of metal interconnect pads on a microelectronic device or the like and the corresponding pattern of interconnect pads on the substrate. The metal ball arrays may be used for testing and/or may be heated and reflowed to bond the microelectronic device to the substrate.

REFERENCES:
patent: 5118027 (1992-06-01), Braun et al.
patent: 5129573 (1992-07-01), Duffey
patent: 5193738 (1993-03-01), Hayes
patent: 5208980 (1993-05-01), Hayes
patent: 5229016 (1993-07-01), Hayes et al.
patent: 5246880 (1993-09-01), Reele et al.
patent: 5377902 (1995-01-01), Hayes
patent: 5377961 (1995-01-01), Smith et al.
patent: 5411602 (1995-05-01), Hayes
patent: 5415679 (1995-05-01), Wallace
patent: 5431332 (1995-07-01), Kirby et al.
patent: 5560543 (1996-10-01), Smith et al.
patent: 5643353 (1997-07-01), Wallace et al.

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