Process for manufacturing liquid ejection head

Details Process for manufacturing liquid ejection head Process for manufacturing liquid ejection head

2008-05-13

2008-05-13

Wilczewski, M. (Department: 2822)

Semiconductor device manufacturing: process

Manufacture of electrical device controlled printhead

C438S976000, C216S027000

Reexamination Certificate

active

11298187

ABSTRACT:
A process includes forming a protective layer in a region of a substrate including a PAD electrode; forming a soluble resin layer in a region including a region on the substrate where an energy generating element has been formed, for forming a liquid chamber; forming a coating resin layer in a region covering the soluble resin layer and a region where an opening is formed above the electrode; forming an opening in the coating resin layer above the energy generating element to form a nozzle; dipping the substrate in an dissolving liquid to dissolve the soluble resin layer; and removing the protective layer after dissolution of the soluble resin layer.

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